Low Inductive SiC Power Electronics Module with Flexible PCB Interconnections and 3D Printed Casing

Silicon carbide (SiC) power devices are steadily increasing their market share in various power electronics applications. However, they require low-inductive packaging in order to realize their full potential. In this research, low-inductive layouts for half-bridge power modules, using a direct bonded copper (DBC) substrate, that are suitable for SiC power devices, were designed and tested. To reduce the negative effects of the switching transients on the gate voltage, flexible printed circuit boards (PCBs) were used to interconnect the gate and source pins of the module with the corresponding pads of the power chips. In addition, conductive springs were used as low inductive, solder-free contacts for the module power terminals. The module casing and lid were produced using additive manufacturing, also known as 3D printing, to create a compact design. It is shown that the inductance of this module is significantly lower than the commercially available modules.