Magnetron sputtering and electron beam evaporation systems for pure boron thin film coatings

Abstract Deposition of boron-containing coatings is determined by their promising use for surface modification goals. In this work, we consider the equipment for the implementation of two plasma methods for the deposition of thin films of pure boron on the surface. These are a magnetron sputtering with a crystalline boron target heated in the discharge, and a system of an evaporation of pure boron target by an electron beam generated using forevacuum plasma source. The features of functioning, and operating parameters of these devices are presented. The deposition rate of boron coatings on the samples was about 20 nm/min for magnetron sputtering. The boron film deposition rate was significantly higher and reached 1 µm / min.