Thermal Side-channel Leakage Protection in Monolithic Three Dimensional Integrated Circuits

Monolithic 3D (M3D) ICs are promising 3D technology to overcome conventional integration’s communication bottleneck. It also offers advantages like high-density integration, reduced wirelength, power, and heterogeneous systems enabling new 3D architectures for IoT applications. However, it introduces opportunities and challenges from a hardware security perspective. As the M3D ICs experience severe heat dissipation, they are more susceptible to thermal side-channel analysis attacks. This work proposes to exploit built-in self-test architecture and power supply noise in M3D in a randomized fashion to thwart thermal side-channel attacks.