Investigating the performance of a NMPCM integrated heat sink for chipset cooling

The demand for effective cooling solutions is critical for electronic chip sets, since it improves the operation and longevity of electronic equipment. The heat removal from a finned heat sink (HS) integrated computer processor with the aid of a nano-mixed PCM (NMPCM) is investigated in this work. The heat generation of the chipset is replicated with the aid of a plate heater and the plate-finned heat sink is studied under three conditions, the first configuration is the plate-finned heat sink containing no PCM (FHS), the second configuration is the HS containing the plain PCM (P-FHS), and the last configuration is the HS containing a nanoparticle mixed PCM (NP-FHS). The NMPCM was prepared through the careful mixing of 0.5% nano-titania within the paraffin. The results showed that the assimilation of PCM and NMPCM with the finned-HS (NP-FHS) was verified to be effective in reducing the heating rate of the chip sets, comparing to the FHS and P-FHS configurations. Explicitly, the NMPCM had assisted to postpone the baseline temperature of the HS by 32 min and 14 min, respectively at the heating rate of 3.5 kW/m2 and 4.5 kW/m2, respectively.