A new type of dual-branch composite structure-based ultrasonic transducer for microelectronic interconnection and packaging
Applied Acoustics(2022)
Abstract
•A new type of dual-branch ultrasonic transducer for microelectronic interconnection and packaging is proposed.•A complete set of design methods for the newly proposed transducer is developed systematically.•Performance test results demonstrate the feasibility and effectiveness of the design idea and the relevant design method.•The salient features in the energy superposition and power-sharing give the transducer a good deal of flexibility.
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Key words
Microelectronic interconnection and packaging,Piezoelectric ultrasonic transducer,Thermosonic bonding,Composite structure,Electromechanical four-terminal network
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