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Investigation of Electrical and Thermal Behavior of Modified Epoxy Structures for DC and High Frequency Applications

M. Awais,C. Dai, F. B. Meng,A. Paramane, X. Wang,X. Chen

22nd International Symposium on High Voltage Engineering (ISH 2021)(2021)

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Key words
thermal behavior,modified epoxy structures,high frequency applications,epoxy resin insulation,high voltage insulation materials,different curing agent concentrations,thermal properties,high frequency stress,high curing agent concentrations,thermal performance,electrical performance,suitable electrical properties,electrical behavior
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