Recent Advances and Trends in Multiple System and Heterogeneous Integration With TSV-Less Interposers
IEEE Transactions on Components, Packaging and Manufacturing Technology（2022）
摘要
In this study, the recent advances and trends in multiple system and heterogeneous integration with through-silicon via (TSV)-less interposer (organic interposer or 2.3-D IC integration) will be investigated. Emphasis is placed on the definition, kinds, advantages and disadvantages, challenges (opportunities), and examples of multiple system and heterogeneous integration with TSV-less interposer. Also, some recommendations of 2.3-D IC integration will be provided.
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关键词
23-D IC integration,multiple system and heterogeneous integration,through-silicon via (TSV)-less interposer
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