High Pressure Deuterium Annealing for Improved Immunity Against Stress-Induced Threshold Voltage Degradation
IEEE Transactions on Device and Materials Reliability(2022)
摘要
We demonstrate that high pressure deuterium (HPD) annealing presents effective process knob to achieve excellent threshold voltage (
$\text{V}_{\mathrm{ TH}}$
) stability and superb electrical performance of MOSFETs. While devices without HPD annealing show significant negative shift in
$\text{V}_{\mathrm{ TH}}$
, the device with HPD annealing exhibits excellent
$\text{V}_{\mathrm{ TH}}$
stability under identical bias stress conditions. Due to the superior interface quality provided by HPD annealing, we achieve much lower SS and higher on-current along with negligible
$\text{V}_{\mathrm{ TH}}$
shift, which is desirable for multi-threshold and high-performance logic device.
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关键词
Annealing,bias stress,n-MOSFETs,high-pressure deuterium (HPD) annealing,hot-carrier injection (HCI),instability,reliability
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