Simulation and Analysis to Minimize Audio Noise in System Design

2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)(2022)

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摘要
This paper presents a flow of modeling and simulating acoustic noise in a typical earbud design. The noise source investigated is the multi-layer ceramic capacitor, known as singing capacitor, which is widely used on the power delivery network of electronic circuit boards. Good correlation between simulated and measured audio noise spectra is achieved. The developed modeling methodology helps to understand the key factors impacting on audio noise, and to provide a way to identify potential acoustic noise risk at the early design stage. Possible mitigation solutions are also investigated to demonstrate the model flexibility in what-if analysis.
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关键词
audio noise,power delivery network (PDN),singing capacitor,mechanical vibration
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