Improving the precision of semiconductor overlay measurements using dark-field digital holographic microscopy
Imaging and Applied Optics Congress 2022 (3D, AOA, COSI, ISA, pcAOP)(2022)
摘要
We present dark-field digital holographic microscopy for diffraction-based overlay metrology in semiconductor layers with feature size of a few nanometers. We aim for higher accuracy and precision by calibrating the illumination profile on the targets.
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关键词
semiconductor overlay measurements,digital holographic microscopy,precision,dark-field
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