Research On Bonding Process of Heavy Aluminum Wire For Metal Package Power Device

Heavy aluminum wire bonding has a wide range of applications in the field of metal package power device wire interconnection, its quality has always been one of the key factors affecting device performance. The orthogonal experiment was used to research the influence of process parameters such as bonding pressure, bonding power on the bonding strength of ultrasonic wedge bonding for 380μm heavy aluminum wire. The range of influence was revealed by the combination of range analysis, variance analysis and regression analysis. The results show that the bonding pressure has the most significant effect on the bonding strength. The cause analysis of the debonding phenomenon that occurred during the test was carried out to provide a reference for the ultrasonic wedge wire bonding process of heavy aluminum wire.