A Method to Measure Residual Stress of Liquid Molding Compound by In-Situ Characterizations

The rapid development of the electronic information industry brings to the irreplaceable role of electronic components, therefore the search for more reliable packaging material has become increasingly important. In the electronic packaging system, the failure phenomenon caused by residual stress is one of the key factors restricting the development of electronic packaging technology. This paper proposes to use the in-situ characterization technology designed and developed by ourselves to explore the residual stress-inducing mechanism and failure mechanism of Liquid Molding Compound (LMC). It is found that as the nano-silica content increased, the residual stress, the storage modulus, bending modulus, and bending strength also showed trends of increasing. The variation patterns of residual stress coincide with the physical property parameters of the material, which also proves the feasibility of the proposed method.