Research on heat dissipation performance and reliability of embedded copper core PCB

In this study, two kinds of embedded copper core substrates, partially buried copper block PCB (through type) and partially buried copper PCB (semi-buried type), were used to evaluate their heat dissipation capabilities, and metallographic analysis was performed on the quality of solder joints after environmental tests. It found that the heat dissipation capacity of the components on the partially buried copper block PCB (through type) and the partially buried copper PCB (semi-buried type) was significantly higher than that of the copper-free PCB. After the environmental assessment test, the solder joints had no cracks exceeding 25% of the effective lap length, the alloy layer was continuous without cracks, and the solder joints met the requirements of ECSS standards.