Embedded manifold cooling system for high performance computing ICs

The number of datacenters worldwide has increased substantially over the past two decades to handle the large amount of information and data available. To meet the complex computing requirements, the thermal design power of high-performance computing (HPC) increases, leading to serious thermal management challenges. In this study, embedded manifold cooling (EMC) system for HPC ICs is proposed. It is successfully maintaining the temperature rise of commercial CPU to 18K under thermal stress conditions. By processing the embedded microchannel on the bulk silicon and bonding with 3D manifold structure, the coolant is directly introduced into the chip to minimize the thermal resistance between the heat source and ambient. Integrated miniature circulating pump and heat exchanger ensure the cooling system is compatible with the existing computing system. The results show that the cooling performance of embedded manifold cooling under thermal stress conditions is 71.4% higher than that of air cooling and 60.7% higher than that of immersion cooling.