Response Behavior of Typical Wire Looping under Random Vibration for Wire Bonding Packaging

With the ever-increasing function of electronics, the dramatically increased interconnection density brings challenge to the traditional yet cost effective wire bonding packaging. Since the pitch of bonding wires shrinks down, the risk of short circuit rises, especially, reliability issue is a key concern when the wire bonding packaging suffers from random vibration. In order to understand the response behavior of wire looping under vibration loading, this work is aiming to expore the relationship between different looping parameters, e.g., looping span, looping height and conner radius of bonding wire. Proposed herein is an effective method for predicting maximum swing displacement of the wire looping under Random Vibration. The bonding wire geometry is modeled based on the metrology of actual bonding wires. The modal analysis of the model was presented using finite element method (FEM). Power spectral density (PSD) is applied demonstrate the loading condition. The effects of looping span, looping height and corner radius of bonding wire on the maximum swing displacement were studied. Simulations demonstrated that the shape of the bonding wire could dramatically alter the maximum swing displacement. In addition, the corner radius of bonding wire mildly affect the maximum swing displacement. High-Speed micro-camera test verified the consistency between simulations and experimental results. This study provides useful insights for loop design to ensure the reliability of modern microelectronic packaging.