Characterization of Cordierite Based h‐BN Doped Ceramics as an Electronic Substrate/Circuit Board Material

In this study, h-BN was added to the cordierite composition obtained from zeolite, which was prepared by the determined stoichiometry to facilitate machinability and increase thermal conductivity. Sintering behavior, hardness, machinability, and thermal/electrical properties of the samples obtained by sintering the compounds at different times were investigated. Thanks to these features, it is aimed to use cordierite as an alternative material to integrated circuit substrates and electronic packaging materials. The produced samples were analyzed by X-ray diffraction analysis, examined by scanning electron microscopy, and field emission scanning electron microscopy. Afterward, thermal properties such as thermal diffusivity, thermal conductivity, and electrical properties such as electrical conductivity and dielectric permittivity were measured. The hardness and machinability of samples were investigated. Cordierite, spinel, glassy phase, and h-BN phase were detected, and it was observed that the blocky cordierite grains turned into equiaxed grains with the increase of the h-BN. According to the results obtained from the thermal conductivity test, it was seen that the h-BN additive increased the thermal conductivity value in general. In addition, it was determined that with the increase of h-BN, the hardness decreased, and the machinability properties of the samples improved.