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High Power Conductively Cooled Laser Diode Array Operating Under Hard Pulse Condition

COMPONENTS AND PACKAGING FOR LASER SYSTEMS VIII(2022)

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Abstract
We report the latest development of a high power conductively cooled laser module using a novel design approach. The laser bar is directly bonded to two heatsinks in a sandwich configuration without employing submounts as buffers for stress relief caused by CTE mismatch. Simulations were performed to aid the laser module design. The accuracy of the simulations was verified by experimental tests on the laser modules. Production data were collected and used to determine the key performance parameters, statistical distribution, lifetime, and failure mechanism. The laser module thermal rollover could reach 480W at 500A drive current under CW running mode. Furthermore, it could continuously operate under a harsh-hard pulse driving condition at 300A drive current with 300ms pulse width and 1Hz repetition rate.
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Key words
hard-pulse, high power, conductively cooled, packaging technology, lifetime, production data
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