A dimensional stability measurement method for the vacuum-encapsulated insulation panel under different temperature environment

In view of the limitations of the existing monitoring methods for dimensional stability of the vacuum-encapsulated insulation panel under high and low temperature environment, based on digital image correlation (DIC) measurement technology and high and low temperature environment test technology, this paper proposes a multi-face dimensional stability measurement method under temperature change environment through the research of multi-face synchronous noncontact measurement design and low temperature measurement method for anti-condensation frost. This method aims to achieve accurate monitoring of dimensional stability of the vacuum-encapsulated insulation panel under high and low temperature environment. The non-contact deformation measurement system for multi-faces at high temperature and low temperature was designed, and a high-precision thermal deformation test platform was built. The measurement accuracy verification test was carried out, and the test results showed that the measurement accuracy of the system was better than 2×10^-6/°C in the temperature change environment. The measurement of dimensional stability of the vacuum-encapsulated insulation panel is successfully realized by using the test platform.