17.4 Peak-Current-Controlled Ganged Integrated High-Frequency Buck Voltage Regulators in 22nm CMOS for Robust Cross-Tile Current Sharing

Nachiket Desai,Harish K. Krishnamurthy,Khondker Ahmed,Sheldon Weng,Suhwan Kim,Xiaosen Liu,Huong T. Do,Kaladhar Radhakrishnan,Krishnan Ravichandran,James W. Tschanz,Vivek De

2021 IEEE International Solid- State Circuits Conference (ISSCC)（2021）

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摘要

High-performance many-core processors and GPUs demand 100s of Watts of power in a single voltage/power domain on chip, operating below 1V. High-frequency and highcurrent-density fully integrated voltage regulators (FIVRs) with in-package air core inductors (ACIs) [1] or on-package magnetic inductors can deliver power with high efficiency and low distribution losses in compact footprints. Multiple FIVR tiles must be “ganged” to support the large on-chip voltage/power domains while meeting the reliability constraints of the active and passive elements, and maintaining high overall efficiency.

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关键词

robust cross-tile current sharing,magnetic inductors,in-package air core inductors,peak-current-controlled ganged integrated high-frequency buck voltage regulators,22nm CMOS,ACIs,high-performance many-core processors,GPUs,voltage/power domain,multiple FIVR,reliability constraints,passive elements,active elements

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