Design of a Broadband HTCC SIP Packaging Module
2021 International Conference on Microwave and Millimeter Wave Technology (ICMMT)(2021)
Abstract
In this paper, we use the characteristics of high temperature co-fired ceramic materials, a novel broadband electromagnetic transmission structure is designed and verified by simulation and experiment. Based on this structure and combined with gold wire bonding, BGA, ect. we obtain a broadband RF multi-chip SIP packaging module, which can be in a compact size of broadband RF front end integration into a ceramic SIP package.
MoreTranslated text
Key words
broadband HTCC SIP packaging module,high temperature co-fired ceramic materials,gold wire bonding,ceramic package,broadband electromagnetic transmission structure,broadband RF multichip packaging module,front end integration
AI Read Science
Must-Reading Tree
Example
![](https://originalfileserver.aminer.cn/sys/aminer/pubs/mrt_preview.jpeg)
Generate MRT to find the research sequence of this paper
Chat Paper
Summary is being generated by the instructions you defined