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Design of a Broadband HTCC SIP Packaging Module

Yang Zhang Zhang,Wei Wei,Wang Yong,Sun Biao,Zhang XingWen, Xun Jun, Fei Xin Xing

2021 International Conference on Microwave and Millimeter Wave Technology (ICMMT)（2021）

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Abstract
In this paper, we use the characteristics of high temperature co-fired ceramic materials, a novel broadband electromagnetic transmission structure is designed and verified by simulation and experiment. Based on this structure and combined with gold wire bonding, BGA, ect. we obtain a broadband RF multi-chip SIP packaging module, which can be in a compact size of broadband RF front end integration into a ceramic SIP package.
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Key words
broadband HTCC SIP packaging module,high temperature co-fired ceramic materials,gold wire bonding,ceramic package,broadband electromagnetic transmission structure,broadband RF multichip packaging module,front end integration
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