Heat Transfer Augmentation of a Heat Sink Heat Pipe Through a Chemical Micro/Nano-Roughening Method: An Experimental Approach

The continued depreciation of electronic components presents severe challenges for thermal management. Regarding this issue, the current experimental study targets to propose and assess a modified liquid-based cooling module in which the fins are chemically etched using our lab-made simple, cost-efficient, and environmental-friendly method to achieve better cooling performance in electronics temperature management applications. Scanning electron microscopy and atomic force microscopy tests are executed to investigate the heat sink surfaces' micro/nano roughened structure. Its performance is compared to the typical aluminum heat sink. Results of the tests and related comparative studies of the three cooling modules (typical, liquid-based, and liquid-based micro/nano roughened heat sinks) are presented as well where effects of constant/intermittent heat fluxes (4000-12000 W/m2) and the volume flow rates of testing fluid on heat transfer characteristics, thermal resistance, and temperature behavior are disclosed. Based on findings under intermittent heat flux, a nearly 3.4 °C reduction in maximum temperature and 13.8% enhancement in decreases of the minimum temperature of modified heat sink compared to those of a typical heat sink is observed. Moreover, it is found that the modified heat sink without testing fluid and with water at volume flow rates of 100 and 200 ml/min decreases the thermal resistance by 11.9, 13.73, and 3.6%, in order, in comparison with the typical heat sink.