基体厚向梯度化聚酰亚胺复合材料制备与表征
Journal of Aeronautical Materials（2022）
Abstract
研制树脂传递模塑成型(RTM)用聚酰亚胺树脂基体RTM-PI,采用RTM工艺制备基体厚向梯度化聚酰亚胺复合材料,提升复合材料热稳定性能.基体梯度化复合材料包括RTM-PI树脂基芯层和高热稳定树脂基表层,RTM成型工艺参数基于树脂升温热失重、流变和固化反应数据确定.结果表明:RTM-PI树脂兼具低黏度、超长工艺适用期和耐高温性能,最低黏度在0.1 Pa?s以下,工艺期在300 min以上,玻璃化转变温度达到445℃;基体厚度梯度化复合材料内部质量优异,350℃热老化100 h的失重相对纯RTM-PI复合材料可降低48％以上.
MoreTranslated text
Key words
matrix gradation along thickness direction,polyimides,composites,resin-transfer-molding (RTM),thermal stability
AI Read Science
Must-Reading Tree
Example
Generate MRT to find the research sequence of this paper
Chat Paper
Summary is being generated by the instructions you defined