High-Integration and Low-Cost Transmitter Packaging Solution for 0.2 THz SiP Application Using HTCC Technology

A high-integration and low-cost transmitter packaging solution for 0.2-THz system-in-package (SiP) application is newly presented using high-temperature co-fired ceramic (HTCC) technology. To improve 3-D integration, internal vertical air-filled interconnection waveguides buried in the HTCC package are explored and fabricated. A compact MoCu waveguide bandpass filter (BPF) is designed and integrated into the package to suppress the harmonic output of the mixer. To demonstrate the potential SiP application in the future 0.2-THz radar systems, based on the proposed solution, two 0.2-THz transmitters using frequency multipliers/mixer are designed, fabricated, and measured. All the components are buried in HTCC, and the overall size is $36\times 14\times9.8$ mm ³ and $54\times 14.5\times9.8$ mm ³ , respectively. Both the transmitters show good performance, and the measured output power is better than 8 and 5 dBm, respectively.