Latent cure epoxy resins for reliable joints in secondary-bonded composite structures

In high-performance polymer matrix composite assemblies, adhesive bonding is generally superior to mechanical fastening in structural performance and manufacturing efficiency. However, adhesive bonds are susceptible to minute levels of contamination accumulated during assembly that can lead to unpredictable, weak bonds. Current methods of measuring bond strength are all destructive mechanical tests. To overcome these challenges, redundant load paths (e.g., mechanical fasteners) are often implemented in secondary-bonded, primary-structures, which can greatly reduce structural performance. This study investigated reformulated aerospace epoxy matrix resins with stoichiometric offset to inhibit cure of the matrix resin prior to assembly. Inhibited resins can reflow and mix across the joint interface, which eliminates the material discontinuity and forms a homogenous joint with reliable fracture properties. The goal of this study was to develop and demonstrate secondary composite assemblies that are mechanically and microscopically indistinguishable from a co-cured composite joint. This article describes the development of latent epoxy resins, the fabrication of test articles, and the mechanical properties measured from experimental joints compared with conventional, co-cured laminates. Methods of in-line quality control using and infrared spectroscopy and post-assembly forensics are also described. The final mode-II fracture toughness measured from precracked AERoBOND specimens was similar to that measured from co-cured laminates indicating that later cure epoxy materials could be a suitable replacement for secondary bonding.