Effects of Remote Boundary Conditions on Clamping Loss in Micromechanical Resonators

Journal of Microelectromechanical Systems(2022)

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摘要
Clamping loss in micromechanical resonators can strongly depend on the boundary conditions far away from the actual vibrating structure because the acoustic wavelength greatly exceeds the device dimensions. We demonstrate a scheme for post-fabrication tuning of the clamping loss in flexural-mode and bulk-mode resonators by modifying the boundary conditions of the chip with the frame. The measured ...
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关键词
Clamps,Resonators,Q-factor,Thermomechanical processes,Boundary conditions,Force,Semiconductor device measurement
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