A review on efficient heat-dissipating coatings for applications in thermal management technology of electronic components
2nd International Conference on Mechanical, Electronics, and Electrical and Automation Control (METMS 2022)(2022)
摘要
Recently, ever-increasing requirements of the application environment with respect to working efficiency, environmental adaptability and energy efficiency, it is impossible for traditional active heat dissipation technologies to adapt to the needs of modern electronic components which are miniaturised and highly integrated. To achieve high heat flux conduction in micro spaces, for example, it will significantly reduce the utilization ratio of internal space of electronic components if we use traditional cooling techniques such as wind cooling and water cooling. In this and similar applications, a heat dissipation system which can improves both heat flux density and utilization ratio of space is urgently needed, while efficient heat-dissipating coatings can perfectly fit for this application requirement, addressing the limitations that problems of heat dissipation present in the development of this realm. In this paper we review the research status of efficient heat-dissipating coatings at home and abroad and analyse the rational application of heatdissipating coatings, especially those working in infrared radiation mode, under different requirements.
更多查看译文
关键词
thermal management technology,coatings,heat-dissipating
AI 理解论文
溯源树
样例
![](https://originalfileserver.aminer.cn/sys/aminer/pubs/mrt_preview.jpeg)
生成溯源树,研究论文发展脉络
Chat Paper
正在生成论文摘要