Effects of Solder Thickness on Interface Behavior and Nanoindentation Characteristics in Cu/Sn/Cu Microbumps
Welding in the World（2022）
关键词
Cu/Sn/Cu microbumps,Solder thickness,IMCs,Binary diffusion,Nanoindentation
AI 理解论文
溯源树
样例
生成溯源树，研究论文发展脉络
Chat Paper
正在生成论文摘要