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3-Layer Stacked Pixel-Parallel CMOS Image Sensors Using Hybrid Bonding of SOI Wafers.

Masahide Goto,Yuki Honda,Masakazu Nanba,Yoshinori Iguchi,Takuya Saraya,Masaharu Kobayashi,Eiji Higurashi,Hiroshi Toshiyoshi,Toshiro Hiramoto

IEEE TRANSACTIONS ON ELECTRON DEVICES（2023）

Cited 2|Views3
Key words
3-D integrated circuits,analog-to-digital converters (ADCs),damascene integration,image sensors,silicon-on-insulator (SOI),wafer bonding
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