Advanced 3d Design and Technologies for 3-Layer Smart Imager

Pascal Vivet,Lucile Arnaud,Stéphan Borel,Nicolas Bresson,Myriam Assous,Stéphane Nicolas,Gaëlle Mauguen,Stéphane Moreau,Mauricio Altieri,Olivier Billoint,Sébastien Thuriès,Eric Ollier

2022 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA)（2022）

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Abstract

CMOS Imagers have adopted 3D integration using Back-Side Illumination (BSI) technology, with 2 CMOS layers assembled using Wafer-to-Wafer and advanced Hybrid Bonding technology. Targeting innovative AI and Machine Learning application, for offering AI processing at the edge within the image sensor itself, this paper presents some new 3D design and technology solutions in order to build a 3-layer S...

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Key words

Image sensors,Three-dimensional displays,Lighting,Machine learning,Very large scale integration,CMOS technology,Silicon

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