Assessment of critical Co electromigration parameters

O. Varela Pedreira, M. Lofrano,H. Zahedmanesh,Ph. J. Roussel,M. van der Veen, V. Simons,E. Chery, I. Ciofi,K. Croes

2022 IEEE International Reliability Physics Symposium (IRPS)（2022）

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摘要

We perform a detailed assessment of the electromigration performance of Co interconnects. Package level EM measurements were performed during >11 months. Our estimate of the EM activation energy is ~1.4 eV which is, within error bar, consistent with earlier reported numbers. Our current exponent estimate suggests that void growth is the dominant contributor to Co EM. Through failure analysis, w...

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关键词

Electromigration,Grain boundaries,Maximum likelihood estimation,Current measurement,Failure analysis,Tin,Reliability

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