New Method to Perform TDDB Tests for Hybrid Bonding Interconnects

B. Ayoub,S. Moreau,S. Lhostis, P. Lamontagne, H. Combeau,J. G. Mattei, H. Frémont

2022 IEEE International Reliability Physics Symposium (IRPS)（2022）

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摘要

Hybrid Bonding (HB) is progressing as the major solution for 3D integrated-circuit with pitch reduction becoming the key. Reliability needs to be studied with HB pitch reduction for possible evaluation of new failure mechanisms and modes. In this paper, we developed a new methodology to study Time-Dependent Dielectric Breakdown (TDDB) at HB level that accounts wafer-to-wafer (W2W) overlay variatio...

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关键词

Semiconductor device modeling,Spectroscopy,Three-dimensional displays,Shape,Semiconductor device reliability,Failure analysis,Dielectric breakdown

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