An Automated Room Temperature Flip-Chip Mounting Process for Hybrid Printed Electronics
Micromachines（2022）
关键词
bump-less bonding,conductive adhesive interconnection,flip chip,standardized interconnection,hybrid printed systems,room temperature bonding,automated mounting process,dispensing process influences,inkjet printing,flexible hybrid electronics
AI 理解论文
溯源树
样例
生成溯源树，研究论文发展脉络
Chat Paper
正在生成论文摘要