Enhancing Reliability and 2 Mm-Axial Mechanical Bending Endurance by Gate Insulator Improvements in Flexible Polycrystalline Silicon TFTs
IEEE Transactions on Electron Devices（2022）
Key words
Bending,Stress,Silicon,Thin film transistors,Helium,Reliability,Logic gates,Flexible electronics,flexible low-temperature polycrystalline silicon thin film transistors (LTPS TFTs),mechanical bending stress,negative-bias temperature stress (NBTS)
AI Read Science
Must-Reading Tree
Example
Generate MRT to find the research sequence of this paper
Chat Paper
Summary is being generated by the instructions you defined