Characterization and modeling of a typical curing material for photoresist films
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)（2022）
Abstract
The photo imaging process is one of the most important advances in the production of printed circuit boards (PCBs). Especially, UV-curable resins are widely used in the semiconductor and microelectronics industries and are becoming increasingly popular due their options to modernize manufacturing processes, as the introduction of the Laser Direct Imaging (LDI). Compared to conventional UV exposure...
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Key words
photoresist films,typical curing material
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