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Pressing Simulations within the PCB Manufacturing Framework

Christian Schipfer, Peter Fuchs, Matthias Morak, Qi Tao, Julia Zuendel

2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)(2022)

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Abstract
The present work shows the application of the Coupled-Eulerian-Lagragian (CEL) method in Finite Element (FE) simulations of pressing processes in the field of PCB manufacturing. The CEL approach prevents the problem of high element distortion in such process simulations. The required material properties of prepreg resins are determined experimentally via Differential Scanning Calorimetry (DSC) and rheometer measurements. Based on the obtained data a computationally efficient material model is implemented. It allows for the consideration of the viscous resin flow until vitrification affected by the fiber reinforcement and copper structure during the pressing process. Thus, the presented framework can be used to determine the time for the complete filling of voids in the trace pattern, the resin content of the final layer and the required pressing pressure profile for a given final layer thickness.
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Key words
pcb manufacturing framework,simulations
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