Experimental study of transient heat transfer and temperature dynamics in the electronics enclosures
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)(2022)
摘要
Uncontrolled local enclosure climate is one of the main causes of moisture related electronics failures such as electrochemical metal migration, corrosion, alternation of material properties and etc. To prevent these failures during lifespan of electronics systems, it is very important to understand well the mechanism of heat and mass transport into electronics and phase changes processes. The obj...
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关键词
transient heat transfer,heat transfer,temperature dynamics
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