Comparison of Manifold Learning Algorithms for Rapid Circuit Defect Extraction in SPICE-Augmented Machine Learning
2022 IEEE 19th Annual Workshop on Microelectronics and Electron Devices (WMED)(2022)
Abstract
Identifying the source of integrated circuit (IC) degradation and being able to track its degradation via its electrical characteristics (e.g. the Voltage Transfer Characteristics, VTC, of an inverter) is very useful in failure analysis. This is because the electrical measurement is non-destructive, low-cost, and rapid. However, the extraction of defects from electrical characteristics requires si...
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Key words
Degradation,Resistance,Reverse engineering,Training data,Machine learning,Production,SPICE
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