Cyclic Scheduling of Single-Arm Cluster Tools with Multiple Wafer Types: A Case Study

Xin Li, Jiongjiong Tian

Advances in Transdisciplinary EngineeringApplied Mathematics, Modeling and Computer Simulation(2022)

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摘要
Cluster tools are widely used in the industrial production process, such as semiconductor wafers, printing circuit board and other fields. In this paper, the scheduling problem of cluster tools with multi-type wafers is studied, including robot handling jobs sequencing and wafer processing sequencing. Based on the detailed analysis of the operations in the problem, there are the processing time window constraints, robot available constraints, processing capacity constraints. Then, due to the complexity in the general conditions, a case with four different wafers (including one for each type in a cycle) is considered. The applied model was solved by the third-party library Gurobi in PyCharm.
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关键词
scheduling,multiple wafer types,single-arm
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