Kinematics and material removal mechanisms of loose abrasive machining

Free abrasives distributed in a paste or liquid (a so-called suspension or slurry) remove extremely thin layers of workpiece material in loose abrasive machining processes and hence are responsible for material removal. Abrasive grains can also be applied without lubrication in dry powder form. The chips in these processes are much thinner than in grinding because of the significantly lower material removal rate. Microcutting, material removal by microdeformation or microcrack initiation, and microfusion are the primary material removal mechanisms of loose abrasive machining processes. Because abrasive grains are loose and can move independently, they must be forced into the workpiece with an object like a polishing cloth or a lapping wheel (also called a lapping plate). This chapter provides detail about the kinematic and material removal mechanisms involved in lapping, polishing, mass finishing, and chemomechanical polishing are explained in detail.