Design of High-Speed Driver Circuits Based on Thick Film Technology

In order to improve system integration without compromising system performance, this paper presents the design and implementation of driver circuits of a TDI CCD detector using in a remote sensing satellite. The capacitive loads of the CCD detector up to 4 nF are indispensable for the present cameras. The driver circuits take up too much area and space of PCB board for the excessive number and variety of CCD detector driving signals. It is a challenge that designs these high-speed driver signals since drive large capacitive loads while meeting the rise and fall time requirements. This paper presents the design and test results from CCD drivers. Based on thick film technology, the integration of the discrete driver devices circuit reduces the PCB area to 33% than the convention PCB area. In this paper, the design of driving circuit and the selection of driving components are presented in detail. The CCD detector and driver circuits are placed in flex-rigid PCB. In the experiment, the output signal of the module integrated with the thick film measured by the oscilloscope completely meets the requirement of the TDI CCD detector.