High Density Redistribution Layers (< 2 μm L/S) for Chiplets Packaging

Increased demand for chiplets-based designs in advanced packages for leading applications like artificial intelligence and high power computing is driving the need for finer Cu distribution layers to meet their package I/O density and bandwidth performance requirements. In this paper, we demonstrate the feasibility of SAP method for 0.8 and $1 \mu \mathrm{m}$ Cu redistribution lines on multi-layer RDL. Electrical test results on meander comb lines and daisy chains structure show good connectivity for fine-pitch and high-density Cu RDL for chiplets packaging.