High Density Redistribution Layers (< 2 μm L/S) for Chiplets Packaging
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)(2021)
摘要
Increased demand for chiplets-based designs in advanced packages for leading applications like artificial intelligence and high power computing is driving the need for finer Cu distribution layers to meet their package I/O density and bandwidth performance requirements. In this paper, we demonstrate the feasibility of SAP method for 0.8 and $1 \mu \mathrm{m}$ Cu redistribution lines on multi-layer RDL. Electrical test results on meander comb lines and daisy chains structure show good connectivity for fine-pitch and high-density Cu RDL for chiplets packaging.
更多查看译文
关键词
high density redistribution layers
AI 理解论文
溯源树
样例
![](https://originalfileserver.aminer.cn/sys/aminer/pubs/mrt_preview.jpeg)
生成溯源树,研究论文发展脉络
Chat Paper
正在生成论文摘要