Vertically coupled GalnAsP/lnP microring lasers fabricated by using full wafer bonding

Helmut Heidrich,M. Hamacher, U. Troppenz,Dimitrios Syvridis,Dimitris Alexandropoulos,Spiros Mikroulis,Chyng Wen Tee,Kevin A. Williams,Viorel Dragoi,Marin Alexe,D. Cristea,C. Kusko,Mihai Kusko

european conference on optical communication（2007）

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Abstract

We summarize results on the processing and characterization of current injected 1.55 μm single- and multi-microring lasers including vertical active/passive waveguide coupling. The devices were fabricated by GaInAsP/InP-GaAs full-wafer bonding using a BCB interface.

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Key words

full wafer bonding,galnasp/lnp,lasers

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