Heat dissipation investigation of high power pcb in extreme thermal environment

Heat dissipation mode in an infinite space and extreme thermal environment is numerically studied and optimized for a PCB through improving the structure of a sun shield,modifying the layout of the PCB,and setting an insulation cavity.It is found that cooling effectiveness can be evidently improved via adopting the above-mentioned method according to the power and location of various heat generation elements in the PCB.