Research on the Thermal Reliability of Multi-Unit Power Integrated Module

Multi-unit IGBT PIM (Power Integrated Module) is widely used in industrial transmission and household air conditioning due to its small size, light weight and low switching loss. More and more attention is paid to its reliability. Through a simulation study, the package structure of a PIM with a three-phase bridge rectifier, a chopper and a three-phase IGBT module was analyzed. Due to the limitation of package structure, chopper circuit works at the highest temperature. By comparing the temperature distribution of a SiC hybrid PIM using SiC Schottky barrier diodes instead of Si fast recovery diodes with the original Si-PIM, the chip layout and vertical packaging structure of the SiC hybrid PIM are optimized. The high thermal conductivity material such as graphene was applied to the PIM to improve the thermal reliability performance. After optimization, the maximum temperature of the module can drop by 24°C.