Performance, manufacturability, and qualification advances of high-power VCSEL arrays at TriLumina Corporation

Thomas R. Fanning,John Maynard,Christopher J. Helms, Lei Yang, David Podva, Jeff Earls, Jacob U. Lopez, Michael Chung,James Foresi, Mial E. Warren, Gianluca Bacchin

Vertical-Cavity Surface-Emitting Lasers XXIV（2020）

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摘要

TriLumina develops and manufactures flip-chip VCSEL technology used in 3D sensing applications that must meet automotive grade 1 temperature range (-40˚C to 125˚C) performance and be tested to high reliability standards and criteria (AEC-Q102). Advances in VCSEL efficiency, performance and automotive qualification of TriLumina’s selfhermetic flip-chip VCSEL are discussed. TriLumina’s VCSEL-on-board (VoB), surface-mount technology VCSEL is introduced.

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关键词

VCSEL, VCSEL array, laser array, VCSEL reliability, AEC-Q102, LiDAR

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