Numerical Simulation of PCM-Based Heat Sink with Plate Fins for Thermal Management of Electronic Components

In this study, a comprehensive 2-D numerical study is conducted to investigate the heat transfer performance of phase change material (PCM)-based finned heat sink for the purpose of thermal management of electronic devices. Heat sinks are made up of aluminum and filled with paraffin wax as PCM. Various configurations of heat sink, such as plain, one fin, and two fin heat sinks are studied in this investigation. The effect of number of fins and heat flux on heat transfer performance is studied. A constant input heat flux is applied from the bottom side of the heat sink. Transient numerical simulations are performed using the Ansys fluent software. The 2-D governing equations for continuity, momentum and energy are solved by using volume of fluid (VOF) model for PCM and air composite and enthalpy porosity model is used for the phase change phenomena of PCM. The results are presented in terms of temperature variations, melt fractions and time to reach critical setpoint temperature (SPT). The results show that increasing the heat flux value increases the melting rate of PCM and increasing the number of fins increases the heat transfer performance of PCM-based heat sink.