Stacking of Two-Dimensional Materials to Large-Area Heterostructures by Wafer Bonding

A Quellmalz,S Sawallich,M Prechtl,O Hartwig,S Luo, S Wagner

user-5fe1a78c4c775e6ec07359f9（2021）

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摘要

The integration of 2D materials for photonic applications is not compatible with high-volume manufacturing. We report a generic methodology that uses only readily available semiconductor equipment and experimentally demonstrate the stacking of graphene and molybdenum disulfide (MoS 2 ).

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关键词

stacking,two-dimensional materials,large-area heterostructures,wafer bonding,photonic applications,high-volume manufacturing,generic methodology,readily available semiconductor equipment,C-MoS2

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