(Invited) Parylene C Based Adhesive Bonding on 6” and 8” Wafer Level for the Realization of Highly Reliable and Fully Biocompatible Microsystems

The ongoing miniaturization and implementation of new functionalities into micro-electro-mechanical systems (MEMS) demand the development and application of new wafer bonding and encapsulation technologies with a high performance. Requirements are low process temperatures, high mechanical strengths of the bonded interface, as well as the applicability on large wafer sizes. Within the presented study, the polymer Parylene C was used as an adhesive for the bonding of 6” and 8” wafers. Doing so, the material combinations of the wafers, the Parylene thicknesses and geometries as well as the bonding parameters were varied. The properties of the wafer compounds were characterized with various methods, including mechanical tests, infrared imaging, cross-sections, hermeticity tests and the investigation of the thermal reliability. Using the Parylene C bonding process, tensile strengths of up to 35 MPa, and shear strengths of up to 80 MPa were realized. The determined helium leakage rate was lower than 1 ∙ 10-7 mbar ∙ l/s and the thermal reliability was verified to be excellent.