A 160 Gb/s (4×40) WDM O-band Tx subassembly using a 4-Ch array of silicon rings co-packaged with a SiGe BiCMOS IC driver

45th European Conference on Optical Communication (ECOC 2019)(2019)

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Abstract
We demonstrate a 4-channel O-band transmitter comprising a Silicon Photonics RM array co-packaged with a SiGe BiCMOS integrated dnver chip. 4×40 Gb/s data modulation with an average ER of 3.39 dB is reported, with the transmitter module exhibiting a high energy efficiency of 2.52 pJ/bit.
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Key words
OPTICAL TRANSMITTER,SILICON PHOTONICS,MICRORING MODULATORS,O-BAND
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