Thermal Property Measurements of Si µ-Cantilever Beams Using the Suspended Thermoreflectance Technique

Abstract Thermoreflectance is a common technique to measure thermal properties of micro/nano devices. Most thermoreflectance techniques use a pump-probe scheme with lasers to heat the sample and analyze the temperature. The limiting characteristics of most of these techniques are that they can probe the temperature at only one spot on the sample, assume a value for either heat capacity or thermal conductivity to find the other, and require a semi-infinite substrate. In this paper, a new technique is described, the Suspended ThermoReflectance (STR) technique, which allows measurement of thermal conductivity by probing multiple points along the length of a suspended micro/nano-scale sample. This technique involves a pump laser for heating the tip of a suspended μ-cantilever Si beam and a probe laser to scan the temperature along the μ-cantilever’s length. Thermal conductivity is obtained by applying the heat diffusion equation for the temperature gradient along the beam length. 2.9 μm thick Si μ-cantilever samples are tested over a range of temperatures from 20–300K. It is found that thermal conductivity of the silicon varies from 28 W/mK to 80 W/mK.